The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2007
Filed:
Feb. 28, 2006
Fei Ying Wong, Hong Kong, HK;
Wai Keung Ho, Hong Kong, HK;
Ho Wang Wong, Hong Kong, HK;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A lead frame () for a semiconductor device includes a first row of terminals () surrounding a die receiving area () and a second row of terminals () spaced from and surrounding the first row of terminals (). The first and second rows of terminals () have a first height (H). The terminals () of the first row include a step () that has a greater height (H). Bond wires () connecting die pads () to the first row terminals () extend over the second height Hpart of the terminal () and are attached to the first height Hpart of the terminal (). The step () insures that the bond wires () attached to the stepped terminals () have a high wire kink profile so that they are less susceptible to damage in later process steps.