The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2007
Filed:
Mar. 16, 2004
Jinbao Jiao, Gurnee, IL (US);
Kevin D. Moore, Hoffman Estates, IL (US);
Thomas P. Gall, Northbrook, IL (US);
William C. Weigler, New Braunsfels, TX (US);
Jinbao Jiao, Gurnee, IL (US);
Kevin D. Moore, Hoffman Estates, IL (US);
Thomas P. Gall, Northbrook, IL (US);
William C. Weigler, New Braunsfels, TX (US);
Temic Automotive of North America, Inc., Deer Park, IL (US);
Abstract
An apparatus and method for an adhesive assembly for securing a printed circuit board to a substrate. The assembly provides a printing tool with a plurality of apertures defined therethrough. Preferably, the apertures have a top opening with a larger area than a bottom opening. The printing tool is placed upon one of the printed circuit board and/or substrate, and a liquid adhesive is printed onto the printing tool. The liquid adhesive forms islands of adhesive within each aperture. Removing the printing tool deforms each island to form a raised edge at a periphery of each island. A temporary liner can be placed on the raised edges to protect the adhesive until the printed circuit board can be assembled with the substrate.