The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7300607 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 27, 2007

Filed:

May. 27, 2004
Applicants:

Toshiyuki Misonou, Mobara, JP;

Masahiro Kato, Mobara, JP;

Inventors:

Toshiyuki Misonou, Mobara, JP;

Masahiro Kato, Mobara, JP;

Assignee:

Futaba Corporation, Mobara-shi, Chiba-ken, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); H01B 1/22 (2006.01); H01B 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A conductive sintered compact for fixing electrodes inside an electronic device envelope is provided. The sintered compact is made of a conductive composition calcined. The conductive composition includes at least 10 vol % to 60 vol % of Ag particles, a low melting-point glass containing 10 vol % to 80 vol % of BO, 0 vol % to 70 vol % of ceramic particles, and a metal oxide series pigment. The total amount of the ceramic particles and the metal oxide series pigment is at least 10 vol % or more.


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Misonou, Toshiyuki. (2007). Conductive sintered compact for fixing electrodes in electronic device envelope (U.S. Patent No. 7300607). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7300607

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