The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2007

Filed:

Jan. 15, 2004
Applicants:

Sundaresan Jayaraman, Atlanta, GA (US);

Sungmee Park, Atlanta, GA (US);

Inventors:

Sundaresan Jayaraman, Atlanta, GA (US);

Sungmee Park, Atlanta, GA (US);

Assignee:

Georgia Tech Research Corp., Atlanta, GA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/06 (2006.01); B23K 31/02 (2006.01); D03D 23/00 (2006.01); D03D 3/02 (2006.01); D03D 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed are systems or apparatuses and methods for forming a junction between conductive fibers that are incorporated into a fabric. Briefly, one method includes the steps of removing insulation from two intersecting individually insulated conductive fibers to expose the individually conductive fibers, bringing the exposed individually conductive fibers into contact with each other at a junction point, and forming a molecular bond between the conductive fibers at the junction point. Also disclosed are systems for forming a junction between conductive fibers that are incorporated into a fabric. In this regard, one embodiment of such a system can include a first apparatus that removes insulation from two intersecting individually insulated conductive fibers to expose the individually conductive fibers, a second apparatus that brings the exposed individually conductive fibers into contact with each other at a junction point, and a third apparatus that aids in formation of a molecular bond between the conductive fibers at the junction point.


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