The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2007

Filed:

Feb. 03, 2006
Applicants:

Wolfgang Hoppe, Bad Tölz, DE;

Srdjan Djordjevic, München, DE;

Inventors:

Wolfgang Hoppe, Bad Tölz, DE;

Srdjan Djordjevic, München, DE;

Assignee:

Infineon Technologies, AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 8/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor memory module, which is formed as an FBDIMM memory module, for example, has a planar design. In the 2R×4 configuration, semiconductor components are arranged in two rows on a top side of a module board and semiconductor memory components are likewise arranged in two rows on an underside of the module board. In contrast to a 'Stacked DRAM' design, the semiconductor components in accordance with the planar design contain only one memory chip. By using a parallel routing for a command address bus and an on-die termination bus, the address, clock, and control buses can be adapted in terms of load, so that different signal propagation times on the different buses are avoided to the greatest possible extent.


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