The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2007
Filed:
Jun. 15, 2005
Troy Everette Conner, York, PA (US);
Justin Shane Mcclellan, Camp Hill, PA (US);
Matthew Richard Mcalonis, Elizabethtown, PA (US);
Attalee S. Taylor, Palmyra, PA (US);
Troy Everette Conner, York, PA (US);
Justin Shane McClellan, Camp Hill, PA (US);
Matthew Richard McAlonis, Elizabethtown, PA (US);
Attalee S. Taylor, Palmyra, PA (US);
Tyco Electronics Corporation, Middletown, PA (US);
Abstract
A heat sink assembly includes a circuit board, a first integrated circuit package and a second integrated circuit package mounted to the circuit board in a stacked relation to one another. A first heat sink is engaged to and is in thermal communication with the first integrated circuit package, and a second heat sink is engaged to and is in thermal communication with the second integrated circuit package, wherein each of the first and second heat sinks are positioned over the first and second integrated circuit packages on a single side of the circuit board. Optionally, the first heat sink may include an opening extending therethrough and exposing the second integrated circuit package. The second heat sink may extend through the opening and engage the second integrated circuit package.