The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2007
Filed:
Aug. 04, 2004
Nobutake Tsuyuno, Chiyoda-ku, JP;
Toshiaki Ishii, Chiyoda-ku, JP;
Toshiya Satoh, Chiyoda-ku, JP;
Mitsuhiro Masuda, Chiyoda-ku, JP;
Nobutake Tsuyuno, Chiyoda-ku, JP;
Toshiaki Ishii, Chiyoda-ku, JP;
Toshiya Satoh, Chiyoda-ku, JP;
Mitsuhiro Masuda, Chiyoda-ku, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
In order to provide a low-cost and high heat-radiating electronic circuit device featuring high compactness, little warpage, high air tightness, high moldability, high mass productivity, high reliability against thermal shocks, and high oil-proof reliability, a module structure made by packing a whole multi-layer circuit board which connects a semiconductor operating element, semiconductor memory elements, and passive elements thereon and part of a supporting material on which said multi-layer circuit board is placed into a single package by transfer-molding; wherein said multi-layer circuit board and said supporting material are bonded together with a compound metallic material made up from copper oxide and at least one metal selected from a set of gold, silver, and copper.