The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2007
Filed:
Apr. 29, 2004
Applicant:
Cheol-joon Yoo, Cheonan, KR;
Inventor:
Cheol-Joon Yoo, Cheonan, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
A stacked BGA package and a method for manufacturing the stacked BGA package, with reduced size and/or height of a unit package, which may also reduce an electrical connection length. The stacked BGA package may include a base BGA package having at least one semiconductor chip, and a plurality of BGA packages which are stacked on the base BGA package. A plurality of solder balls may electrically connect the base BGA package and the plurality of BGA packages and may then be sealed to reduce the likelihood of damage.