The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2007
Filed:
Dec. 22, 2003
Hiroshi Kushitani, Izumisano, JP;
Ichiro Kameyama, Katano, JP;
Hiroshi Kushitani, Izumisano, JP;
Ichiro Kameyama, Katano, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
The present invention relates to a high frequency laminated component, which is used in a high frequency apparatus such as a radio communication apparatus, and its manufacturing method. An object thereof is to downsize the high frequency laminated component. To achieve the object, according to the high frequency laminated component of the present invention, dielectric layer () whose dielectric constant is lower than that of other areas is formed around via-hole electrode () in a dielectric. By forming dielectric layer () having a low dielectric constant, electric interference between via-hole electrode () and circuit electrode () is restrained, so that the circuit electrode and the via-hole electrode can be formed more closely each other compared with a conventional one. As a result, the high frequency laminated component can be downsized.