The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2007
Filed:
Dec. 30, 2004
Applicant:
Jung Joo Kim, Bucheon-si, KR;
Inventor:
Jung Joo Kim, Bucheon-si, KR;
Assignee:
Dongbu Electronics Co., Ltd., Seoul, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/335 (2006.01); H01L 21/331 (2006.01); H01L 21/76 (2006.01); H01L 21/4763 (2006.01); H01L 21/44 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of fabricating a via and a trench is disclosed. A disclosed method comprises: forming a via hole and a trench in a interlayer dielectric layer on a semiconductor substrate where a predetermined device is formed; depositing a thin Hf layer on the substrate; performing a thermal treatment of the substrate to getter oxygen and forming a barrier layer; and filling copper into the via hole and the trench.