The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2007
Filed:
Jun. 24, 2005
Michael Alan Vallance, Albany, NY (US);
John Robert Campbell, Clifton Park, NY (US);
Kenneth Paul Zarnoch, Scotia, NY (US);
Prameela Susarla, Clifton Park, NY (US);
Bryan Patrick Duffey, Ballston Spa, NY (US);
Gary William Yeager, Rexford, NY (US);
Michael Joseph O'brien, Clifton Park, NY (US);
Michael Alan Vallance, Albany, NY (US);
John Robert Campbell, Clifton Park, NY (US);
Kenneth Paul Zarnoch, Scotia, NY (US);
Prameela Susarla, Clifton Park, NY (US);
Bryan Patrick Duffey, Ballston Spa, NY (US);
Gary William Yeager, Rexford, NY (US);
Michael Joseph O'Brien, Clifton Park, NY (US);
General Electric Company, Niskayuna, NY (US);
Abstract
An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionalized polymer and at least one reactive monomer composition. The reactive monomer composition may include a reactive monomer component that may be a low temperature solid and may be present in an amount in the reactive monomer composition a range of greater than about 20 weight percent based on the total weight of reactive monomer composition. The mixture, at about low temperature, may be solid or tack-free, or both solid and tack-free.