The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2007
Filed:
May. 12, 2006
Heat dissipating type printed circuit board and structure thereof for conducting heat with heap pipe
Tse-hsine Laio, Xindian, TW;
Ting-kuo Kao, Xindian, TW;
Tse-Hsine Laio, Xindian, TW;
Ting-Kuo Kao, Xindian, TW;
Giga-Gyte Technology Co. Ltd., Taipei, TW;
Abstract
A heat dissipating type printed circuit board and its structure for conducting heat with a heat pipe include a substrate, a signal circuit disposed on a surface of the substrate and electrically coupled to an electronic component, a heat dissipating layer disposed on another surface of the substrate, and at least one heat pipe, each having a heated end and a condensing end extended from the heated end. The substrate includes a through hole passing through the heat dissipating layer, and the heat dissipating layer includes an adhering layer disposed at a surface proximate to the surroundings of the heat pipe, and a distal end of the heated end of the heat pipe is covered by the adhering layer, and the adhering layer is extended from the surface of the heat dissipating layer to a corresponding position of the electronic component.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile