The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2007
Filed:
Aug. 04, 2005
Applicants:
Katsuhito Takeuchi, Toyokawa, JP;
Naohito Mizuno, Kariya, JP;
Shinichi Hirose, Okazaki, JP;
Hiroyuki Ban, Hazu-gun, JP;
Inventors:
Katsuhito Takeuchi, Toyokawa, JP;
Naohito Mizuno, Kariya, JP;
Shinichi Hirose, Okazaki, JP;
Hiroyuki Ban, Hazu-gun, JP;
Assignee:
Denso Corporation, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device is composed of a heat sink, an IC chip mounted and fixed on a specific face of the heat sink, a lead frame electrically connected to the IC chip and a sealing mold resin package. One or more of the faces of the heat sink has a specific surface area.