The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2007

Filed:

Mar. 30, 2006
Applicants:

Kazuo Kinoshita, Nara, JP;

Nobuhito Hirosumi, Fukuyama, JP;

Takashi Yasudome, Fukuyama, JP;

Hiroaki Tsukamoto, Yamatotakada, JP;

Inventors:

Kazuo Kinoshita, Nara, JP;

Nobuhito Hirosumi, Fukuyama, JP;

Takashi Yasudome, Fukuyama, JP;

Hiroaki Tsukamoto, Yamatotakada, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01J 5/02 (2006.01); H01L 31/0203 (2006.01);
U.S. Cl.
CPC ...
Abstract

A screw portion is provided on an image sensing unit, a screw hole portion to be engaged with the screw portion is provided on an optical path delimiter, and the screw portion and the screw hole portion are engaged together to thereby fix the image sensing unit and the optical path delimiter so that a lens barrel of the optical path delimiter is in contact with a transparent lid bonded to a surface of a solid-state image sensor. The solid-state image sensor, the transparent lid, a DSP, a wiring board and the like are sealed by a sealing portion made of a resin. Even when distortion occurs due to warpage, flexure or the like on the board where the solid-state image sensor is disposed, the accuracy of the positioning of the lens with respect to a pixel area of the solid-state image sensor is never decreased, it can be prevented that the solid-state image sensor or a signal processor is damaged by an external shock, and the optical device module is easily fabricated.


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