The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2007
Filed:
Jun. 27, 2005
Hideya Murai, Tokyo, JP;
Tadanori Shimoto, Tokyo, JP;
Kazuhiro Baba, Tokyo, JP;
Katsumi Kikuchi, Tokyo, JP;
Hideya Murai, Tokyo, JP;
Tadanori Shimoto, Tokyo, JP;
Kazuhiro Baba, Tokyo, JP;
Katsumi Kikuchi, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
In a sheet material (), a bonding layer () is provided, and then a high-strength layer () is laminated on the bonding layer (). The bonding layer () is made of an epoxy resin being a thermosetting material. The high-strength layer () is made of polyimide, which is not softened at a thermosetting temperature of the epoxy resin and has a tensile rupture strength higher than that of the cured thermosetting material. Moreover, the polyimide has a tensile rupture strength of 100 MPa or higher at 23° C. and a tensile rupture elongation of 10% or higher at 23° C. Assuming that a tensile rupture strength at −65° C. is a and a tensile rupture strength at 150° C. is b, a ratio (a/b) is 2.5 or less.