The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2007
Filed:
Sep. 01, 2004
Takayuki Teshima, Kanagawa, JP;
Takayuki Yagi, Kanagawa, JP;
Yasuhiro Shimada, Kanagawa, JP;
Takashi Ushijima, Kanagawa, JP;
Takayuki Teshima, Kanagawa, JP;
Takayuki Yagi, Kanagawa, JP;
Yasuhiro Shimada, Kanagawa, JP;
Takashi Ushijima, Kanagawa, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating mask layer to expose the electrically-conductive portion, and a first plated or electrodeposited layer is deposited in the openings and on the insulating mask layer by electroplating or electrodeposition. A second plated layer is further formed on the first plated or electrodeposited layer and on the electrically-conductive portion by electroless plating to reduce a size distribution of microstructures over the array.