The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2007

Filed:

Dec. 05, 2002
Applicants:

Nolan Zimmerman, Kalispell, MT (US);

Gregory J. Wilson, Kalispell, MT (US);

Steve L. Eudy, Kalispell, MT (US);

Inventors:

Nolan Zimmerman, Kalispell, MT (US);

Gregory J. Wilson, Kalispell, MT (US);

Steve L. Eudy, Kalispell, MT (US);

Assignee:

Semitool, Inc., Kalispell, MT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assembly () can comprise a support member () that includes an inner wall () which defines an opening () configured to receive the workpiece and a plurality of contacts (). The individual contacts () include a conductor () and a cover (). The conductor () can comprise a proximal section () projecting inwardly into the opening () relative to the support member (), a distal section () extending from the proximal section (), and an inert exterior () at least at the distal section (). The cover () comprises a dielectric element that covers at least the proximal section of the conductor, but does not cover at least a portion of the distal section of the core. The exposed portion of the distal section of the core, accordingly, defines a conductive contact site for contacting a conductive layer (e.g., a seed layer) on the workpiece.


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