The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2007
Filed:
Jun. 02, 2004
Brian Massey, Marlborough, MA (US);
Brian Massey, Marlborough, MA (US);
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A method of adjusting the attachment of an optical fiber to a laser diode chip within a butterfly package, or any equivalent package, identifies the location of the solder attachment on the optical fiber, thereby moving one or more high power lasers so that their respective beams are incident on the solder attachment. Then, with the application of high power laser pulses according to a predetermined pulse schedule, the solder attachment is heated so that the optical fiber may shift vertically therein. By using an internal or external monitoring means such as an optical power meter, a determination is made when the optical alignment has reached a desired threshold such as when it exceeds a desired optical power output. The pulse schedule may be performed multiple times until a substantially optimized coupling is achieved for the final package.