The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2007

Filed:

Jan. 17, 2003
Applicants:

Mark Rossmeisl, Franklin, MA (US);

Frank John Marszalkowski, Jr., Cumberland, RI (US);

Joseph A. Perault, Natick, MA (US);

Inventors:

Mark Rossmeisl, Franklin, MA (US);

Frank John Marszalkowski, Jr., Cumberland, RI (US);

Joseph A. Perault, Natick, MA (US);

Assignee:

Speedline Technologies, Inc., Franklin, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/00 (2006.01); B05D 5/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

A system for depositing solder paste on a print window of a printed circuit board through a stencil includes a housing providing a printing chamber, a depositor configured to move relative to the housing and to deposit the solder paste, a support device disposed in the printing chamber and configured to receive the circuit board and to selectively hold the circuit board stationary relative to the housing, a loading mechanism configured to receive the circuit board and to transport the circuit board along a second direction to the support device, a controller coupled and configured to control dispensing of the solder paste by the depositor and the transporting of the circuit board by the loading mechanism, and a rotational apparatus coupled to the support device and configured to rotate the support device, where the controller is configured to cause the rotational apparatus to rotate the support device more than about 10° and to cause the depositor to deposit solder paste onto the circuit board after the rotational device has rotated the support device more than about 10°.


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