The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2007
Filed:
Jan. 03, 2006
Applicants:
Seung Hyun Sohn, Gyeonggi-do, KR;
Yul Kyo Chung, Gyeonggi-do, KR;
Hyun Ju Jin, Busan, KR;
Eun Tae Park, Gyeonggi-do, KR;
Inventors:
Seung Hyun Sohn, Gyeonggi-do, KR;
Yul Kyo Chung, Gyeonggi-do, KR;
Hyun Ju Jin, Busan, KR;
Eun Tae Park, Gyeonggi-do, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention relates to a method of fabricating a printed circuit board having embedded multi-layer passive devices, and particularly, to a method of fabricating a printed circuit board having an embedded multi-layer capacitor, in which a capacitor is formed to have multiple layers in the PCB to increase capacitance.