The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2007

Filed:

Jul. 27, 2005
Applicants:

Lee-long Chen, Taoyuan Hsien, TW;

Chien-hsiung Huang, Taoyuan Hsien, TW;

Yu-hsien Lin, Taoyuan Hsien, TW;

Chin-ming Chen, Taoyuan Hsien, TW;

Inventors:

Lee-Long Chen, Taoyuan Hsien, TW;

Chien-Hsiung Huang, Taoyuan Hsien, TW;

Yu-Hsien Lin, Taoyuan Hsien, TW;

Chin-Ming Chen, Taoyuan Hsien, TW;

Assignee:

Delta Electronics, Inc., Taoyuan Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A liquid-cooling heat dissipation module. The liquid-cooling heat dissipation module circularly dissipates heat from a heat source. The liquid-cooling heat dissipation module includes a fan, a pump, a heat sink, and a guide member. The pump is attached to the fan and driven by the fan. The heat sink is coupled to the fan, and has an opening for receiving the pump. A guide member is disposed in the opening of the heat sink and communicates with the pump. The guide member has a through hole and a guide passage formed on the surface of the guide member. Power provided by the fan, the working fluid in the liquid-cooling heat dissipation module circulates through the through hole, the pump and the guide passage to dissipate heat.


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