The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7291905 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 06, 2007

Filed:

Aug. 08, 2001
Applicants:

Koki Hirasawa, Tokyo, JP;

Hiroyuki Kimura, Kumamoto, JP;

Inventors:

Koki Hirasawa, Tokyo, JP;

Hiroyuki Kimura, Kumamoto, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A lead frame of the present invention includes a plurality of tie bars including tie bars each having deformable portions that protect opposite outside frames from deformation. The outside frames each are formed with positioning holes. Element loading portions to be loaded with semiconductor elements are connected to the outside frames by such tie bars. The lead frame is therefore free from deformation during lead forming while promoting the miniaturization of the semiconductor devices.


Find Patent Forward Citations

Hirasawa, Koki. (2007). Lead frame, semiconductor device produced by using the same and method of producing the semiconductor device (U.S. Patent No. 7291905). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7291905

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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