The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2007
Filed:
Apr. 27, 2005
Applicants:
Takashi Matsuda, Kawasaki, JP;
Suguru Warashina, Kawasaki, JP;
Masanori Ueda, Yokohama, JP;
Osamu Kawachi, Yokohama, JP;
Yasufumi Kaneda, Yokohama, JP;
Inventors:
Takashi Matsuda, Kawasaki, JP;
Suguru Warashina, Kawasaki, JP;
Masanori Ueda, Yokohama, JP;
Osamu Kawachi, Yokohama, JP;
Yasufumi Kaneda, Yokohama, JP;
Assignees:
Fujitsu Media Devices Limited, Yokohama, JP;
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/06 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H03H 9/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
A package substrate includes signal pads provided on a main surface of the package substrate, footpads provided on a backside of the package substrate, and a sealing electrode provided on the main surface to surround the signal pads, the signal pads being electrically coupled to the footpads, the sealing electrode being insulated from the footpads.