The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2007

Filed:

Jul. 21, 2005
Applicants:

Rickard Liljedahl, Linköping, SE;

Goran Gustafsson, Linköping, SE;

Inventors:

Rickard Liljedahl, Linköping, SE;

Goran Gustafsson, Linköping, SE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 35/24 (2006.01);
U.S. Cl.
CPC ...
Abstract

In an organic electronic circuit, particularly memory circuit with an organic ferroelectric or electret material the active material comprises fluorine atoms and consists of various organic materials. The active material is located between first and second electrode sets constituting respectively bottom and top electrodes of the device. A cell with a capacitor like structure is defined in the active material and can be accessed for an addressing operation via the electrodes. At least one top electrode comprises a layer of gold in contact with active material. A second layer on the top electrode comprises conducting material different from gold or can alternatively also be made of gold. A via connection extends between the second electrode layer and a bottom electrode or another electrode in the bottom electrode layer. In case the second electrode layer is made of gold the via metal of the via connection can also be gold and integral with the second electrode layer. In a method for establishing a top via electrode connection in the device, a first top electrode layer of gold is deposited and a via hole etched therethrough and down to the bottom electrode layer, and via metal is deposited to form a via connection and then a second top electrode layer is deposited above the first electrode layer of gold and contacting the via connection.


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