The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2007
Filed:
Jul. 18, 2003
Hans-jörg Timme, Ottobrunn, DE;
Robert Aigner, Unterhaching, DE;
Lüder Elbrecht, München, DE;
Juha Sakari Ellä, Halikko, FI;
Katri Helena Pohjonen, Espoo, FI;
Pasi Tikka, Munich, DE;
Hans-Jörg Timme, Ottobrunn, DE;
Robert Aigner, Unterhaching, DE;
Lüder Elbrecht, München, DE;
Juha Sakari Ellä, Halikko, FI;
Katri Helena Pohjonen, Espoo, FI;
Pasi Tikka, Munich, DE;
Infineon Technologies A.G., Munich, DE;
Nokia Corporation, Espoo, FI;
Abstract
A filter device and a method for fabricating filter devices can package filters, especially acoustic wave filters, by bonding a carrier (substrate) wafer carrying manufactured filters to another wafer referred to as a capping wafer. A capping wafer/substrate eliminates the need for a conventional package to protect the sensitive filters, which reduces both product size and product costs significantly. Even though additional packaging is possible (i.e. in plastic molded packages, or in glob-top packages), it is not required for the reliability of the filters.