The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2007

Filed:

Oct. 13, 2005
Applicants:

Hitoshi Sakurai, Kakogawa, JP;

Kimihiro Abe, Fuji, JP;

Norio Matsumoto, Atsugi, JP;

Inventors:

Hitoshi Sakurai, Kakogawa, JP;

Kimihiro Abe, Fuji, JP;

Norio Matsumoto, Atsugi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Using a dry film resist that is a photosensitive resin, a resin mask layer is formed around electrodes on a substrate. A solder precipitating composition is applied on the substrate, and this solder precipitating composition is heated to precipitate solder on the surface of the electrodes. Subsequently, in removing the resin mask layer, at least one selected from glycol ethers and aminoalcohols is used. Thereby, the resin mask layer is removed after heating process. This makes it possible to easily remove the heat-processed resin mask layer in a short period of time without damaging solder resist and solder bumps on the substrate.


Find Patent Forward Citations

Sakurai, Hitoshi. (2007). Method for removing resin mask layer and method for manufacturing solder bumped substrate (U.S. Patent No. 7291517). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7291517

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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