The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2007
Filed:
Jul. 12, 2006
Applicants:
Hiroshi Koyama, Kariya, JP;
Tetsuya Kuno, Kariya, JP;
Inventors:
Hiroshi Koyama, Kariya, JP;
Tetsuya Kuno, Kariya, JP;
Assignee:
Toyoda Boshoku Corporation, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01);
U.S. Cl.
CPC ...
Abstract
A manufacturing method for a synthetic resin hollow molded body includes a first injection molding process, a positioning process and a second injection molding process in which each of the contact portions of the first split assembly member, second split assembly member, and the third split assembly member is made to contact the corresponding contact portion and each of the contact portions is joined with the corresponding contact portion by a second injection between the first die and the second die.