The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2007

Filed:

Aug. 21, 2003
Applicants:

Shinya Myojin, Myrtle Beach, SC (US);

Richard L. Bye, Morristown, NJ (US);

Nicholes J. Decristofaro, Chatham, NJ (US);

David W. Millure, Myrtle Beach, SC (US);

Gary A. Schuster, Myrtle Beach, SC (US);

Inventors:

Shinya Myojin, Myrtle Beach, SC (US);

Richard L. Bye, Morristown, NJ (US);

Nicholes J. DeCristofaro, Chatham, NJ (US);

David W. Millure, Myrtle Beach, SC (US);

Gary A. Schuster, Myrtle Beach, SC (US);

Assignee:

Metglas, Inc., Conway, SC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a discontinuous network of nickel silicide phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates.


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