The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2007
Filed:
Nov. 23, 2004
Applicants:
Hideaki Hirabayashi, Yokohama, JP;
Naoaki Sakurai, Yokohama, JP;
Akiko Saito, Yokohama, JP;
Koji Sato, Aichi-ken, JP;
Tomiho Yamada, Ohbu, JP;
Inventors:
Hideaki Hirabayashi, Yokohama, JP;
Naoaki Sakurai, Yokohama, JP;
Akiko Saito, Yokohama, JP;
Koji Sato, Aichi-ken, JP;
Tomiho Yamada, Ohbu, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C09K 3/14 (2006.01); B24D 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A polishing cloth used in the chemical mechanical polishing treatment comprises a molded body of (meth)acrylic copolymer having an acid value of 10 to 100 mg KOH/g and a hydroxyl group value of 50 to 150 mg KOH/g.
Hirabayashi, Hideaki. (2007). Polishing cloth and method of manufacturing semiconductor device (U.S. Patent No. 7291188). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7291188
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile