The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2007

Filed:

Jul. 19, 2006
Applicants:

Robert G. Swisher, Pittsburgh, PA (US);

Alan E. Wang, Gibsonia, PA (US);

William C. Allison, Murrysville, PA (US);

Inventors:

Robert G. Swisher, Pittsburgh, PA (US);

Alan E. Wang, Gibsonia, PA (US);

William C. Allison, Murrysville, PA (US);

Assignee:

PPG Industries Ohio, Inc., Cleveland, OH (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B24D 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to an article for altering a surface of a workpiece, or a polishing pad having a window. In particular, the polishing pad includes a polyurethane urea material wherein the polyurethane urea material contains cells which are at least partially filled with gas. The polyurethane urea material can be prepared by combining polyisocyanate and/or polyurethane prepolymer, hydroxyl-containing material, amine-containing material and blowing agent. The polishing pad according to the present invention is useful for polishing articles, and is especially useful for chemical mechanical polishing or planarization of microelectronic and optical electronic devices such as but not limited to semiconductor wafers. The window of the polishing pad is at least partially transparent and thus, can be particularly useful with polishing or planarizing tools that are equipped with through-the-platen wafer metrology.


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