The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2007

Filed:

Sep. 11, 2006
Applicants:

Shinsaku Toda, Kanagawa, JP;

Shuji Kajinuma, Kanagawa, JP;

Masashi Inoue, Kanagawa, JP;

Inventors:

Shinsaku Toda, Kanagawa, JP;

Shuji Kajinuma, Kanagawa, JP;

Masashi Inoue, Kanagawa, JP;

Assignee:

Tyco Elctronics AMP KK, Kanagawa-Ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/62 (2006.01);
U.S. Cl.
CPC ...
Abstract

An IC package is guided to the proper position therefore on a mounting surface of an IC socket with good mounting workability, while preventing buckling and deformation of contacts. In addition, a guide member is enabled to be urged upward stably, without increasing the number of parts. The IC socket includes: an insulative housing that holds a plurality of contacts; a cover plate; and a lever. A guide member, which includes: a pair of guide rails for guiding the IC package; and a link member for linking the guide rails to each other, is attached to the housing. Spring arms for urging the guide member upward are provided on the guide rails and the link member. Regulating members that regulate upward movement of the guide member at a position, where the guided IC package does not contact the electrical contacts, are provided on the housing and the guide member.


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