The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2007

Filed:

Sep. 15, 2003
Applicants:

Chung-sam Jun, Suwon-si, KR;

Sun-yong Choi, Seongnam-si, KR;

Kwang-soo Kim, Yongin-si, KR;

Joo-woo Kim, Seoul, KR;

Jeong-hyun Choi, Yongin-si, KR;

Dong-jin Park, Gyeonggi-do, KR;

Inventors:

Chung-Sam Jun, Suwon-si, KR;

Sun-Yong Choi, Seongnam-si, KR;

Kwang-Soo Kim, Yongin-si, KR;

Joo-Woo Kim, Seoul, KR;

Jeong-Hyun Choi, Yongin-si, KR;

Dong-Jin Park, Gyeonggi-do, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon, Kyungki-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An automated and integrated substrate inspecting apparatus for performing an EBR/EEW inspection, a defect inspection of patterns and reticle error inspection of a substrate includes a first stage for supporting a substrate; a first image acquisition unit for acquiring a first image of a peripheral portion of the substrate supported by the first stage; a second stage for supporting the substrate; a second image acquisition unit for acquiring a second image of the substrate supported by the second stage; a transfer robot for transferring the substrate between the first stage and the second stage; and a data processing unit, connected to the first image acquisition unit and the second image acquisition unit, for inspecting results of an edge bead removal process and an edge exposure process performed on the substrate using the first image, and for inspecting for defects of patterns formed on the substrate using the second image.


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