The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2007
Filed:
Dec. 13, 2004
Pablo Rodriguez, Dearborn, MI (US);
Douglas K. Maly, Jefferson, MA (US);
Ajay V. Patwardhan, Canton, MI (US);
Kanghua Chen, Canton, MI (US);
Sayeed Ahmed, Canton, MI (US);
Gerardo Jimenez, Southgate, MI (US);
Fred Flett, Bloomfield, MI (US);
Pablo Rodriguez, Dearborn, MI (US);
Douglas K. Maly, Jefferson, MA (US);
Ajay V. Patwardhan, Canton, MI (US);
Kanghua Chen, Canton, MI (US);
Sayeed Ahmed, Canton, MI (US);
Gerardo Jimenez, Southgate, MI (US);
Fred Flett, Bloomfield, MI (US);
Siemens VDO Automotive Corporation, Auburn Hills, unknown;
Abstract
Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.