The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2007
Filed:
Jan. 24, 2002
Christophe Prior, Le Touvet, FR;
Laurent Herard, Grenoble, FR;
Christophe Prior, Le Touvet, FR;
Laurent Herard, Grenoble, FR;
STMicroelectronics SA, Montrouge, FR;
Abstract
A substrate, in particular, a multilayer substrate, includes a mounting and electrical-connection support, and a face for mounting at least one integrated circuit chip (IC chip). The substrate and the mounted IC chip are placed in an injection mold. The injection mold has two parts that surround the periphery of the substrate. One part of the injection mold defines a cavity for molding an encapsulation material thereby encapsulating the IC chip, and includes a face for bearing on the mounting face. At least one recess is provided in one part of the injection mold. The recess defines, above the mounting face, a slot for providing a vent for venting gases. The mounting face includes a region on which a metal outer layer is placed. The metal outer layer extends along the recess and on the bearing face on both sides of the recess.