The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2007
Filed:
Sep. 19, 2006
Kevin Moyher, Clinton, CT (US);
Raymond Allard, Wallingford, CT (US);
Paul Merola, Wallingford, CT (US);
Tao Duan, Beijing, CN;
Jun Zhang, Beijing, CN;
Xin Fu, Beijing, CN;
Wei Wang, Beijing, CN;
Tai Qui, Beijing, CN;
Jason Zhu, Shanghai, CN;
Yunchuan Zhu, Shanghai, CN;
Kevin Moyher, Clinton, CT (US);
Raymond Allard, Wallingford, CT (US);
Paul Merola, Wallingford, CT (US);
Tao Duan, Beijing, CN;
Jun Zhang, Beijing, CN;
Xin Fu, Beijing, CN;
Wei Wang, Beijing, CN;
Tai Qui, Beijing, CN;
Jason Zhu, Shanghai, CN;
Yunchuan Zhu, Shanghai, CN;
Times Microwave Systems, Inc., Wallingford, CT (US);
Abstract
A device for electrically grounding bundled cables includes a first half component having an outer surface portion and an abutting surface portion, and a second half component having an outer surface portion and an abutting surface portion. The outer surface portion of the first half component and the outer surface portion of the second half component each define at least one groove longitudinally extending therealong for accommodating one of a plurality of cables held closely together in a bundled configuration. The abutting surface portion of the first half component and the abutting surface portion of the second half component are configured for engaging and cooperating with one another to form a grounding structure.