The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2007
Filed:
Mar. 02, 2001
Hirokazu Tanaka, Kyoto, JP;
Satoshi Hirono, Kyoto, JP;
Hirokazu Tanaka, Kyoto, JP;
Satoshi Hirono, Kyoto, JP;
Omron Corporation, Kyoto-Shi, JP;
Abstract
The insulating layer formation step of forming an insulating layer-on a base for resin applicationby applying polymeric material, which has been diluted with a solvent, filled with inorganic filler to the base for resin application and by drying the base for resin application; the circuit formation portion forming step of creating a circuit formation portion and a via holein insulating layer-that has been formed in the above described insulating layer formation step by means of a laser treatment; and the circuit formation step of forming a circuit-by plating the circuit formation portion and via holethat have been created in the above described circuit formation portion forming step are provided and the insulating layer formation step, the circuit formation portion forming step and the circuit formation step are repeated a plurality of times in this order and, thereby, a circuit formation part (multi-layered substrate) is manufactured. Accordingly, a multi-layered circuit, even of more than three layers, having an arbitrary circuit formation can easily be manufactured at a low cost.