The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2007
Filed:
Mar. 24, 2005
Makoto Tsuji, Kanagawa, JP;
Hiroshi Yokoyama, Kanagawa, JP;
Shinya Itani, Kanagawa, JP;
Toshiba Kakai Kabushiki Kaisha, Tokyo, JP;
Abstract
To provide a mold clamping apparatus that a new actuator is not necessary for a mold thickness adjustment and that the mold thickness adjustment can be performed at low cost. A mold clamping apparatus has a tie bar having a piston and a coupled groove, a cylinder for mold clamping that has the piston of the tie bar built in and that pressured driving liquid for generating mold clamping force is supplied, a half nut coupled with the tie bar releasably by meshing with the coupled groove, a position sensor detecting a position of a moving direction of the tie bar, a direction change valve changing a supply of the driving liquid between a first cylinder chamber and a second cylinder chamber, and a control apparatus positioning a position of the tie bar at a position that the half nut and the coupled groove are able to be meshed by controlling the direction change valve in response to the position of the tie bar detected by the position sensor.