The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2007
Filed:
Mar. 30, 2004
Ralph A. Barrese, Binghamton, NY (US);
Gary Gajdorus, Binghamton, NY (US);
Allen H. Hopkins, Barton, NY (US);
John J. Konrad, Endicott, NY (US);
Robert C. Schaffer, Newark Valley, NY (US);
Timothy L. Wells, Apalachin, NY (US);
Ralph A. Barrese, Binghamton, NY (US);
Gary Gajdorus, Binghamton, NY (US);
Allen H. Hopkins, Barton, NY (US);
John J. Konrad, Endicott, NY (US);
Robert C. Schaffer, Newark Valley, NY (US);
Timothy L. Wells, Apalachin, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system. At least one selective shield material flow mechanism is used in a selective shield material flow assembly.