The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2007

Filed:

Jun. 15, 2005
Applicants:

Kazuhiko Shiroza, Ishikawa, JP;

Yukiyoshi Takayama, Ishikawa, JP;

Hiroaki Honma, Ishikawa, JP;

Seiji Seki, Ishikawa, JP;

Inventors:

Kazuhiko Shiroza, Ishikawa, JP;

Yukiyoshi Takayama, Ishikawa, JP;

Hiroaki Honma, Ishikawa, JP;

Seiji Seki, Ishikawa, JP;

Assignees:

Komatsu Ltd., Tokyo, JP;

Komatsu Industrial Corp., Tokyo, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B21D 22/21 (2006.01);
U.S. Cl.
CPC ...
Abstract

A die cushion device is comprised of die cushion modules which are independently movable and unitized. The individual die cushion modules are provided with a cushion pad, a servomotor, a power transmission mechanism, a power conversion mechanism and a guide member. By configuring in this way, the design of the die cushion is facilitated, a drive mechanism of the die cushion becomes compact, and the number of types of parts used is decreased.


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