The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2007

Filed:

May. 11, 2004
Applicants:

Michael Khbeis, Severn, MD (US);

George Metze, Millersville, MD (US);

Neil Goldsman, Takoma Park, MD (US);

Akin Akturk, Lanham, MD (US);

Inventors:

Michael Khbeis, Severn, MD (US);

George Metze, Millersville, MD (US);

Neil Goldsman, Takoma Park, MD (US);

Akin Akturk, Lanham, MD (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28F 7/00 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

A cooling device for a microcircuit provides a direct path of thermal extraction from a high heat producing area to a cooler area. A thermal insulation layer is formed on a body having at least one component thereon that generates the high heat producing area. At least one via is formed through an entire thickness of the insulation layer and is in direct communication with the high heat producing area. Heat from the high heat producing area is channeled through each via to the cooler area, which may be ambient atmosphere or a good thermal conductor, such as a heat sink. A thermal conductive material may be deposited within the via and increase the rate of thermal extraction therethrough.


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