The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2007
Filed:
Aug. 05, 2004
Applicants:
Hideaki Kato, Aichi-ken, JP;
Kanae Matsumura, Aichi-ken, JP;
Shunsuke Ohtsuka, Tokyo, JP;
Inventors:
Assignees:
Toyoda Gosei Co., Ltd., Nishikasugai-Gun, Aichi-Ken, JP;
Koha Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A notch portionA is disposed on a formation surface of a wiring patternand is located in a contact point with a wiring patternof an outside substrate, so that a soldermelted by reflow soldering slowly flows up along an edge of the notch portionA, improving a solder-joint performance. The notch portionA is formed in a recess shape as formed by cutting away the substrateand as a result, the melted solder stays in the recess portion, which prevents the melted solder from moving up over the notch portionA.