The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2007
Filed:
Mar. 05, 2004
Yasuyuki Murata, Mie Prefecture, JP;
Atsuhito Hayakawa, Mie Prefecture, JP;
Akihiro Itou, Mie Prefecture, JP;
Yasuyuki Murata, Mie Prefecture, JP;
Atsuhito Hayakawa, Mie Prefecture, JP;
Akihiro Itou, Mie Prefecture, JP;
Japan Epoxy Resins Co., Ltd., Tokyo, JP;
Abstract
A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less among components of n=0 in the following general formula (1) and/or components of n=0 in the following general formula (2) is 50% by mass or more of the entire epoxy resin, or, the total content of components having a molecular weight 400 or less among components of n=0 in the following general formula (1) and/or components of n=0 in the following general formula (2) is 20% by mass or more of the entire epoxy resin. The content of low molecular weight compounds having a molecular weight 200 or less in the granular epoxy resin is 0.3% by mass or less. The granular epoxy resin allows easy handling because it hardly causes blocking during storage and transportation