The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2007
Filed:
May. 06, 2003
Hisanobu Kanamaru, Sagamihara, JP;
Kazuto Kobayashi, Sagamihara, JP;
Hisanobu Kanamaru, Sagamihara, JP;
Kazuto Kobayashi, Sagamihara, JP;
Aida Engineering Co., Ltd., Kanagawa, JP;
Abstract
The lower part of a material to be molded forms a lower, seal with a die. A punch applying a molding force to the material forms an upper seal with the perimeter of the die. The space between the upper and lower, seals forms a pressure chamber that is filled with a fluid. As the punch descends into the die, the fluid is pressurized. The lower seal is a complete seal to prevent leakage of fluid into the die. The upper seal is given a clearance with the die that permits controlled leakage of fluid therepast at a rate that limits the maximum pressure in the pressure chamber while permitting the development of an adequate pressure on the material being molded.