The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2007
Filed:
May. 17, 2005
Wolfgang Hauser, Endlingen, DE;
Heiko Dreher, Winden, DE;
Christian Kimstedt, Freiburg, DE;
Markus Rogalla, Bad Korzingen, DE;
Wolfgang Hauser, Endlingen, DE;
Heiko Dreher, Winden, DE;
Christian Kimstedt, Freiburg, DE;
Markus Rogalla, Bad Korzingen, DE;
Micronas GmbH, Freiburg, DE;
Abstract
A method for testing a chip with a package having connecting pins and mounting the package on a board combines the advantages of a package with inline connecting pins with that of a package with offset connecting pins. The package with inline connecting is inserted into a socket for testing. Before mounting on the board, at least one connecting pin, preferably every second connecting pin, of the package is bent inward by a bending tool to achieve an offset arrangement of the connecting pins. The package is preferably mounted on the board using the bending tool. Since every second connecting pin is not bent inward immediately before insertion of the connecting pins, no subsequent corrective alignment of the offset connecting pins is required.