The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2007

Filed:

May. 03, 2005
Applicants:

Kinji Saijo, Yamaguchi-ken, JP;

Kazuo Yoshida, Yamaguchi-ken, JP;

Hiroaki Okamoto, Yamaguchi-ken, JP;

Shinji Ohsawa, Yamaguchi-ken, JP;

Inventors:

Kinji Saijo, Yamaguchi-ken, JP;

Kazuo Yoshida, Yamaguchi-ken, JP;

Hiroaki Okamoto, Yamaguchi-ken, JP;

Shinji Ohsawa, Yamaguchi-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multilayer printed wiring board having a wiring lead-out port has a signal circuit conductor perfectly covered by an earth circuit in its inside and a wiring lead-out port. A signal circuit conductor having a branch pattern is preferable. A large number of products can be easily manufactured with good size reproducibility. The multilayer printed wiring board is manufactured by selectively etching the copper of a cladding sheet manufactured by bonding a copper foil to a nickel foil with 0.1-3% reduction and forming a signal circuit conductor covered by an earth circuit and the wiring lead-out port.


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