The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2007
Filed:
Oct. 01, 2004
Venu M. Kondapalli, Sunnyvale, CA (US);
Venu M. Kondapalli, Sunnyvale, CA (US);
Xilinx, Inc., San Jose, CA (US);
Abstract
Modular wafers and integrated circuits (ICs), and methods of manufacturing modular ICs. A modular wafer can be optionally divided in various ways to avoid defects while producing a variety of modular ICs. A modular wafer includes an array of element dice separated by a scribe area. The scribe area includes interconnect lines that extend across the scribe area between each adjacent pair of the element dice. Unused interconnect lines can be pulled to a known value using weak pullups or pulldowns. Modular ICs can be manufactured with interconnect lines between each pair of adjacent element dice, in which case a single mask set can be used to manufacture a family of programmable logic devices (PLDs).