The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2007
Filed:
Nov. 29, 2004
Gamal Refai-ahmed, Markham, CA;
Xiaohua H. Sun, Cupertino, CA (US);
Nima Osqueizadeh, Richmond Hill, CA;
Salim Lakhani, Toronto, CA;
Jim E. Loro, San Martin, CA (US);
A. Mei Lan Shepherd-murray, Keswick, CA;
Ross Lau, Toronto, CA;
Gamal Refai-Ahmed, Markham, CA;
Xiaohua H. Sun, Cupertino, CA (US);
Nima Osqueizadeh, Richmond Hill, CA;
Salim Lakhani, Toronto, CA;
Jim E. Loro, San Martin, CA (US);
A. Mei Lan Shepherd-Murray, Keswick, CA;
Ross Lau, Toronto, CA;
ATI Technologies Inc., Markham, Ontario, CA;
Abstract
The present disclosure relates to a thermal management apparatus used to manage temperature of components mounted to a circuit substrate, such as electronic or optical components. The apparatus includes a heat dissipation structure that includes at least one protrusion extending from a surface of the heat dissipation structure. A carrier structure is also included and engages with the heat dissipation structure. The carrier structure includes an aperture that receives the at least one protrusion. Additionally, the apparatus includes at least one biasing structure that is configured to allow movement of the heat dissipation structure relative to the carrier structure and provides a biasing force tending to move the heat dissipation structure and carrier structure together.