The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2007
Filed:
Sep. 14, 2005
Hyung-keun Park, Yongin-si, KR;
Woo-jin Jang, Seoul, KR;
Young-ho Kim, Suwon-si, KR;
Tae-sung Moon, Osan-si, KR;
Hyung-keun Park, Yongin-si, KR;
Woo-jin Jang, Seoul, KR;
Young-ho Kim, Suwon-si, KR;
Tae-sung Moon, Osan-si, KR;
Abstract
A microelectronic device chip including a hybrid Au bump in which foreign materials are not generated in a probe tip in an electrical die sorting (EDS) test is provided. The microelectronic device chip includes a chip pad which is connected to a microelectronic device formed on a substrate and on which the microelectronic device is brought into electrical contact with the outside of the chip. Further, the microelectronic device chip includes a bump which is formed on the chip pad and made up of a composite layer including two or more layers.