The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2007
Filed:
Dec. 07, 2005
Heng Keong Yip, Selangor Darul Ehsan, MY;
Heng Keong Yip, Selangor Darul Ehsan, MY;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A method of making an exposed-pad ball-grid array package () includes applying a conductive sheet () to an adhesive tape (). Stamping the conductive sheet () to form a die pad () and separating the remainder () of the sheet from the adhesive tape () so that only the die pad () remains on the adhesive tape (). A substrate () is applied to the adhesive tape () proximate to the die pad (). A die () is attached to the die pad () and electrically coupled to the substrate (). An encapsulant () is formed around at least a portion of the die (), the die pad () and the substrate () above the adhesive tape (). The adhesive tape () is removed from the die pad (), substrate () and encapsulant (). Conductive balls () are attached to the substrate ().