The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7282388 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 16, 2007

Filed:

Jan. 13, 2004
Applicant:

Jong OH Kwon, Kyungki-do, KR;

Inventor:

Jong Oh Kwon, Kyungki-do, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a method for manufacturing an FBAR device, the device includes a substrate having a certain size, at least one device functional portion performing a resonance function by responding to electrical signals applied from the outside, the device functional portion being formed along a center portion of the substrate while defining a certain air gap therein, plural external electrodes formed on an upper surface of the substrate substantially coming into contact with both opposite edges of the upper surface, the external electrodes being electrically connected to the device functional portion, and a cap bonded onto the substrate so as to function as a cover for covering a remaining portion of the substrate except for the plural external electrodes.


Find Patent Forward Citations

Kwon, Jong. (2007). Method of manufacturing wafer level package type fbar device (U.S. Patent No. 7282388). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7282388

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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